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Japan, US in talks to build chip plant under $550B investment deal
Valor Econômico·JP · US·about 2 hours ago
Doosan Group announced a 970 billion won investment to ramp up production capacity for copper-clad laminates (CCL), a key material for semiconductors and electronics. The move signals confidence in sustained demand for advanced substrates amid global tech supply chain shifts. Details on timeline and specific capacity additions remain undisclosed.
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