China storage makers move up value chain with advanced packaging investments

Chinese storage module makers are shifting from packaging into wafer-level advanced packaging, with Biwin Storage investing 4.5 billion yuan in a third-phase project in Dongguan. This reflects a broader industry trend to capture higher-value segments, likely driven by domestic demand and technology self-sufficiency goals. The move may enhance China's semiconductor supply chain resilience but faces technology and export-control constraints.