IBM and Siemens Partner to Advance Nanostack Chip Development

IBM and Siemens announced a collaboration to accelerate research on nanostack chip technology, which aims to increase transistor density. The partnership combines IBM's chip design expertise with Siemens' electronic design automation tools. This development signals continued industry focus on advanced packaging and 3D stacking to sustain Moore's Law, though specific technical details and timelines remain undisclosed.