TSMC, Intel, Samsung race to adopt ASML next-gen chip machines

TSMC will deploy ASML's most advanced lithography equipment by 2030, Samsung by 2028, while Intel claims it is already mass-producing with the new machine. This signals an intensifying competition in leading-edge semiconductor manufacturing, with Intel's early adoption potentially narrowing the technology gap. The timeline divergence suggests differing confidence in the equipment's readiness and yield, which could reshape market share in AI chips.